Technology Capability
3-Year Technology Roadmap
In line with the advancing requirements of our customers, we are progressively expanding layer count, circuit miniaturization, and hole processing precision.
| Item | 2026 | 2027 | 2028 | |
|---|---|---|---|---|
| Application | Automotive, Display | Automotive, Robotics | Automotive, Defense | |
| Layer | MLB | 22Layer | 24Layer | 26Layer |
| Build-up | 12Layer (5-2-5) | 12Layer (Any-Via) | 14Layer (Any-Via) | |
| Core Thickness | 0.07mm | 0.05mm | 0.04mm | |
| Line / Space | 50/50um | 40/40um | 35/35um | |
| Cu Plating Throwing Power | 85% | 85% | 90% | |
| Mechanical Drill | Ф0.20 | Ф0.15 | Ф0.10 | |
| Laser Drill | Ф0.08 | Ф0.08 | Ф0.07 | |
| PSR Clearance | ±20um | ±20um | ±15um | |
| Impedance Control | ±10% | ±8% | ±8% | |