Process

Process Introduction

From circuit formation to final visual inspection, we operate an in-line production system that handles all 14 process steps on a single line.

  • 01

    Pattern (Dry Film)

    A process for circuit formation. After lamination, the required areas of the coated D/F are photo-cured with a laser, and the circuit is then formed through etching.

    Pattern (Dry Film) Process

  • 02

    Hot Press

    A process that melts and cures the Pre-Preg through heat and pressure to bond the copper foil and inner-layer core, creating a multilayer board.

    Hot Press

  • 03

    Drill (CNC)

    A process that machines holes for the inter-layer conduction (PTH) and component mounting required between each layer.

    Drill (CNC) Process

  • 04

    Laser Drill

    A process that machines Micro-Via holes with a laser beam to form inter-layer connections.

    Laser Drill Process

  • 05

    Copper Plating / Via Fill

    A process that applies chemical and electrical copper plating to the machined holes (PTH, Micro-Via) to achieve electrical conduction.

    Copper Plating / Via Fill Process

  • 06

    Hole Plugging

    A process that fills epoxy resin ink inside the copper-plated PTH to ensure hole reliability.

    Hole Plugging Process

  • 07

    AOI

    A process that detects defects in the formed circuit through automated optical inspection.

    AOI Process

  • 08

    PSR

    A process that applies insulating PSR ink to prevent oxidation of the formed circuit and solder bridges during component mounting.

    PSR Process

  • 09

    Marking

    A process that prints the symbols and markings required for SMT component mounting.

    Marking Process

  • 10

    Surface Finish / ENIG

    A process that applies nickel and gold plating to reduce corrosion, wear and contact resistance of component-mounting pads and to improve solderability.

    Surface Finish / ENIG

  • 11

    Surface Finish / OSP

    Prevents oxidation by coating an organic film over the component-mounting pads.

    Surface Finish / OSP Process

  • 12

    Router

    A process that machines the outline to form the final product shape and size requested by the customer from the working panel.

    Router Process

  • 13

    BBT

    A process that applies electrical resistance to the PCB bare board to inspect the circuits and holes for any abnormalities.

    BBT Process

  • 14

    AFVI / Visual Inspection

    A process that inspects the PCB's external quality through 100% inspection before shipment to the customer.

    AFVI / Visual Inspection Process