Research Technology
Corporate R&D Center
Introducing the HYUNWOO corporate R&D center.
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Research for Our Customers
In 2007, HYUNWOO established a corporate R&D center to meet customer needs through printed circuit board research and to maximize corporate value.
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Research for the Future
The HYUNWOO corporate R&D center aims to produce
Green PCBs that respect humanity and environmental protection for the future.
R&D Focus
HYUNWOO R&D Areas
We are developing core technologies across seven fields, centered on high-density lamination, fine circuitry, and reliability improvement.
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01
Variations of Micro-Via Structures (Any Layer)
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02
Laser-Via Technology for Build-up PCB
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03
Resin Plugging Technology for Small Via Hole
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04
Via-in-Pad Blind Via Technology
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05
50um Line/Space for Inner-layer
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06
Out Core PCB Technology
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07
High-Performance PSR Adhesion Technology